Facility 2.5: AI-Driven Semiconductors
16 - 18 September | Phoenix, Arizona
Chip manufacturing capacity must double by 2027.
Fabs need better facility systems – and faster.
The semiconductor industry is not ready for the demands of the AI revolution. Specialized chips – GPUs, TPUs, NPUs – require new dimensions for yield, and giga-facility scale.
The pace of change in chip innovation is 5 quarters. Facilities technology development takes 5-10 years. To prepare for the imminent impact of AI and reinforce the reliability of existing fabs, facilities need better solutions to be developed faster.
An integrated, cross-facility approach is the only way to achieve velocity. UltraFacilty mirrors a real industry shift – breaking down siloes in UPW, chemicals, wastewater, HVAC, abatement, power systems.
Stay Ahead of Customers Rapidly Evolving Needs
Semiconductor manufacturers rely on UltraFacility as a strategic forum to translate industry change and meet next-generation solution providers.
Connect & Collaborate
Join 850+ facility experts, engineers, and innovators representing semiconductor manufacturers and major companies from across the supply chain.
Discover Cutting-Edge Solutions
Explore 50 technical presentations, each selected for its data-driven approach and practical relevance to facility operations and transformation.
Address Urgent Challenges
Collaborate on critical facilities issues, as defined by our industry partners at Intel, Samsung, Micron, and more, and share solutions with 75+ end user representatives.
Testimonials
UltraFacility was great! The various tracks allow people to focus in on their area of impact or get infor-mation in areas they normally wouldn't see. With new Mega Fabs coming online all tracks have very important information to share.
Kelly Osborne
Sr. Staff Engineer
Intel Corporation
The best UltraFacility to date. The venue was excellent, great attendance and the papers were high quality. Good presence by the industry supply chain and great to see so many HVM Semiconductor.
Gary Van Schooneveld
President
CT Associates
UltraFacility is by far the best opportunity to meet facility engineers within the semiconductor industry.
Marcel Benz
Director of Business Development
Nitto Innovations
Attending the technical conference was an enriching experience. One of the highlights was the showcase of innovative technology, allowing participants to explore cutting-edge advancements.
Cecilia Boon Chia Hui
Principal Water Engineer
Micron Technology
The agenda was excellent. The networking, with over 800 attendees, was the best it has ever been.
John C Painter
Director
Georg Fischer Piping Systems
Attending UltraFacility 2025 was an excellent opportunity to grow my knowledge of UPW systems. The breakout sessions provided actionable insights that I can apply to our current projects.
Leslie Arnold
Principal Eng Facilities Engineering
GlobalFoundries
Attending the UltraFacility Conference 2025 was an incredible experience for my first time. I learned so much from the technical sessions, which provided deep insights into industry challenges and solutions.
Jonnie Woertink
Director – Strategic Growth
Nexpera
Overall, I like the event very much. Agendas were various and I obtained lots of insights. Meetings were also very helpful to expand my network.
Jihoo Son
Engineer
Samsung Electronics
Gathering with industry leaders to learn about the front lines of the semiconductor facilities is energiz- -ing and inspires action. A diverse lineup of events inspires engagement and facilitates networking.
Maria Markel
Senior Process Engineer
ex-SpaceX | ex-Samsung
Meet the UltraFacility Co-moderating Team
We share presentations that are data-driven, non-commercial, and advance solutions to critical industry issues. This distribution of high-quality research is only possible thanks to the efforts of the Co-moderating Team, industry experts from major companies across the supply chain.
ALANA DENNING
Owner
Denning Water Solutions
JAKE DAVIS
Mechanical Engineer, Data Center Design Engineering & Construction
Meta
STEVEN SMITH
Facilities Engineering
Texas Instruments
BOB LEET
Owner
Leet Environmental Consulting
JASON TEWKSBURY
CSTD Innovation UPW Senior Technologist
Intel
ARCHITA SENGUPTA
Principal Engineer
Intel
THAYALAN KULASINGAM
Director Facilities Engineering & Operations
GlobalFoundries
NELLA JAHAN
Principal Engineer, Water Design Team
TSMC Arizona
VARINDER MALIK
Staff Engineer
Samsung Austin Semiconductor
BHARATH GOPAL
Staff Facilities Chemical Engineer
Meta
Industry Partners
2026 Sponsors
Gold Sponsor
2026 Sponsors
UltraFacility in pictures
