Facility 2.5: AI-Driven Semiconductors
16 - 18 September | Phoenix, Arizona
Chip manufacturing capacity must double by 2027.
Fabs need better facility systems – and faster.
The semiconductor is not ready for the demands of the AI revolution. Specialized chips – GPUs, TPUs, NPUs – require new dimensions for yield, and giga-facility scale.
The pace of change in chip innovation is 5 quarters. Facilities technology development takes 5-10 years. To prepare for the imminent impact of AI and reinforce the reliability of existing fabs, facilities need better solutions to be developed faster.
An integrated, cross-facility approach is the only way to achieve velocity. UltraFacilty mirrors a real industry shift – breaking down siloes in UPW, chemicals, wastewater, HVAC, abatement, power systems.
Stay Ahead of Customers Rapidly Evolving Needs
Semiconductor manufacturers rely on UltraFacility as a strategic forum to translate industry change and meet next-generation solution providers.
Connect & Collaborate
Join 800+ facility experts, engineers, and innovators representing semiconductor manufacturers and major companies from across the supply chain.
Discover Cutting-Edge Solutions
Explore 50 technical presentations, each selected for its data-driven approach and practical relevance to facility operations and transformation.
Address Urgent Challenges
Collaborate on critical facilities issues, as defined by our industry partners at Intel, Samsung, Micron, and more, and share solutions with 75+ end user representatives.
Testimonials
Meet the UltraFacility Co-moderating Team
We share presentations that are data-driven, non-commercial, and advance solutions to critical industry issues. This distribution of high-quality research is only possible thanks to the efforts of the Co-moderating Team, industry experts from major companies across the supply chain.
ALANA DENNING
Owner
Denning Water Solutions
JAKE DAVIS
Mechanical Engineer, Data Center Design Engineering & Construction
Meta
STEVEN SMITH
Facilities Engineering
Texas Instruments
BOB LEET
Owner
Leet Environmental Consulting
JASON TEWKSBURY
CSTD Innovation UPW Senior Technologist
Intel
ARCHITA SENGUPTA
Principal Engineer
Intel
THAYALAN KULASINGAM
Director Facilities Engineering & Operations
GlobalFoundries
NELLA JAHAN
Principal Engineer, Water Design Team
TSMC Arizona
VARINDER MALIK
Staff Engineer
Samsung Austin Semiconductor
BHARATH GOPAL
Staff Facilities Chemical Engineer
Meta
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