What is UltraFacility?
UltraFacility is the only technical conference dedicated to semiconductor facility systems — power, water, HVAC, chemicals, gas, and construction — in one place. No other event covers these disciplines together, which matters because the people solving these problems don’t work in silos either.
2026 CONFERENCE THEME
Facility 2.5: AI-Driven Semiconductors
Chip manufacturing capacity must double by 2027. Fabs need better facility systems – and faster.
The semiconductor industry is not ready for the demands of the AI revolution. Specialized chips – GPUs, TPUs, NPUs – require new dimensions for yield, and giga-facility scale. The pace of change in chip innovation is 5 quarters. Facilities technology development takes 5-10 years.
To prepare for the imminent impact of AI and reinforce the reliability of existing fabs, facilities need better solutions to be developed faster. An integrated, cross-facility approach is the only way to achieve velocity. UltraFacilty mirrors a real industry shift – breaking down siloes in UPW, chemicals, wastewater, HVAC, abatement, power systems.
Built Around How Fabs Actually Operate
Intel, Samsung, Micron, and GlobalFoundries don’t manage facility systems in silos — and they’ve told us the conference shouldn’t either. UltraFacility 2026 now covers every critical facility discipline, because the challenges facing next-generation fabs cut across all of them.
High Purity Chemicals
Geopolitical pressure and tighter purity tolerances are reshaping how chemicals are sourced, qualified, and recycled.
Ultrapure Water
Forced recycling transitions and advanced node sensitivity are creating new, poorly understood yield risks in UPW systems.
Electrical & Power
Fabs compete with data centers for grid capacity. Seconds of poor power quality cost millions.
End Users
80+ semiconductor manufacturers shape the agenda and attend — 10% of the conference.
Data Centers
Shared constraints in power, water, and cooling are driving convergence between semiconductor and data center engineering.
Wastewater Treatment & Reuse
Near-total reuse and ZLD are becoming mandatory — while advanced nodes grow less tolerant of trace contaminants.
HVAC
Advanced tools and packaging push thermal densities higher, tightening cleanroom and exhaust specifications.
Gas Exhaust, Emissions, & Abatement
New chemistries and higher tool densities mean exhaust and abatement failures translate directly into downtime.
End User-Driven Agenda
UltraFacility was established to meet the mission critical demands of semiconductor manufacturers, translating their demands into an agenda that is non-commercial, and inherently practical. Semiconductor manufacturers make up 10% of attendance, feature on the technical advisory committee, and shape the program as industry partners.
The result is an agenda built around what facility teams actually need — not what vendors want to sell.
Our Industry Partners:
A phenomenal opportunity for interdisciplinary networking and information exchange.
Zeph Egnasher, Facilities Engineer
Globalfoundries
I like the event very much. I could obtain a lot of insights. Networking was also very helpful to expand my network.
Jihoo Son, Engineer
Samsung Electronics
UltraFacility was great! The various tracks allow people to focus in on their area of impact or get information on other areas that they normally wouldn’t see.
Kelly Osborne, Sr. Staff Engineer
Intel Corporation
An enriching experience. One of the highlights was the showcase of innovative technology, allowing participants to explore cutting-edge advancements.
Cecilia Boon Chia Hui, Principal Water Engineer
Micron Technology
Driving transformative change in semiconductor facilities
Three strands divide the content of our agenda
With 3D heterogeneous geometries, declining technology nodes, and new complex fab tools, how can facilities proactively address acceleratingly stringent quality parameters for chemicals, gases and water?
New sustainability targets, emerging contaminants, and strict regulations pose new problems. How can faciliites balance water circularity, chemicals consumption, energy usage, and gas emissions?
More factories, bigger in scale than ever before, must be built in record time. How can facilities expand alongside supply chain issues, an expertise shortage, and material scarcity?
50 presentations are selected from 100+ submissions by our independent technical advisory committee. Only data-driven, results-focused work makes the agenda — no vendor pitches, no filler.
It’s your chance to present to the 850+ semiconductor facilities professionals attending, including engineers from Intel, Samsung, TSMC, Micron, and GlobalFoundries.
Until submissions close
DEADLINE: 04/24/2026
